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　　本書(shū)是作者從事電子制造40年來(lái)有關(guān)單板互連可靠性方面的經(jīng)驗(yàn)總結(jié)，討論了單板常見(jiàn)的失效模式、典型失效場(chǎng)景以及如何設(shè)計(jì)與制造高可靠性產(chǎn)品的廣泛?jiǎn)栴}，并通過(guò)大量篇幅重點(diǎn)討論了焊點(diǎn)的斷裂失效現(xiàn)象及裂紋特征。全書(shū)內(nèi)容共4個(gè)部分，第一部分為焊點(diǎn)失效機(jī)理與裂紋特征，詳細(xì)介紹焊點(diǎn)的失效模式、失效機(jī)理、裂紋特征及失效分析方法;第二部分為高可靠性產(chǎn)品的焊點(diǎn)設(shè)計(jì)，包括封裝選型、PCBA的互連結(jié)構(gòu)設(shè)計(jì)、組裝熱設(shè)計(jì)及焊點(diǎn)的壽命評(píng)估技術(shù);第三部分為環(huán)境腐蝕與三防處理，重點(diǎn)介紹腐蝕失效與錫須問(wèn)題，以及與之相關(guān)的清洗和三防工藝;第四部分為高可靠性產(chǎn)品的制造，重點(diǎn)介紹組裝工藝控制要點(diǎn)與典型缺陷焊點(diǎn)。本書(shū)可供從手電子制造、可靠性、失效分析工作的工程師學(xué)習(xí)與參考。

作者簡(jiǎn)介

　　賈忠中中興通訊股份有限公司首席工藝專家，從事電子制造工藝研究與管理工作近40年。在中興通訊工作期間，見(jiàn)證并參與了中興工藝的發(fā)展歷程。歷任工藝研究部部長(zhǎng)、副總工藝師、總工藝師、首席工藝專家。擔(dān)任廣東電子學(xué)會(huì)SMT專委會(huì)副主任委員、中國(guó)電子學(xué)會(huì)委員。對(duì)SMT、可制造性設(shè)計(jì)、失效分析、焊接可靠性等有著深入、系統(tǒng)的研究，擅長(zhǎng)組裝不良分析、焊點(diǎn)失效分析。出版作品有：《SMT工藝質(zhì)量控制》《SMT可制造性設(shè)計(jì)》《SMT工藝不良與組裝可靠性》《SMT核心工藝解析與案例分析》等，發(fā)表論文多篇，被粉絲譽(yù)為“實(shí)戰(zhàn)專家”。

圖書(shū)目錄

第一部分焊點(diǎn)失效機(jī)理與裂紋特征
第 1 章焊點(diǎn)的可靠性 ............................................................................................ 3
1.1 焊點(diǎn) ...........................................................................................................................................3
1.1.1 焊點(diǎn)的微觀組織結(jié)構(gòu)及常見(jiàn)失效位置 ........................................................................4
1.1.2 焊點(diǎn)的失效標(biāo)準(zhǔn) ............................................................................................................4
1.1.3 焊點(diǎn)的斷裂類型 ............................................................................................................5
1.2 導(dǎo)致焊點(diǎn)失效的載荷條件 .......................................................................................................7
1.3 焊點(diǎn)失效機(jī)理 ...........................................................................................................................7
1.3.1 溫度循環(huán)引發(fā)的焊點(diǎn)失效機(jī)理 ....................................................................................7
1.3.2 機(jī)械應(yīng)力引發(fā)的焊點(diǎn)失效機(jī)理 ..................................................................................10
1.3.3 熱沖擊引發(fā)的焊點(diǎn)失效機(jī)理 ......................................................................................12
1.3.4 蠕變引發(fā)的焊點(diǎn)失效機(jī)理 ..........................................................................................13
1.4 焊點(diǎn)的可靠性評(píng)價(jià) .................................................................................................................14
1.4.1 焊點(diǎn)的可靠性取決于 PCBA 的互連結(jié)構(gòu)設(shè)計(jì) ..........................................................14
1.4.2 焊點(diǎn)的可靠性工作 ......................................................................................................14
1.4.3 焊點(diǎn)失效原因分析流程 ..............................................................................................15
案例 1：某單板上的 BGA 使用兩年后失效 .............................................................15
第 2 章溫度循環(huán)導(dǎo)致的焊點(diǎn)失效........................................................................... 17
2.1 疲勞失效的典型場(chǎng)景 .............................................................................................................17
2.1.1 整體熱膨脹失配 ..........................................................................................................17
2.1.2 局部熱膨脹失配 ..........................................................................................................18
2.1.3 內(nèi)部熱膨脹失配 ..........................................................................................................18
2.2 疲勞失效的裂紋演進(jìn)過(guò)程與特征 .........................................................................................18
2.2.1 片式元件焊點(diǎn)疲勞失效典型裂紋特征 ......................................................................19
2.2.2 翼形引腳焊點(diǎn)疲勞失效典型裂紋特征 ......................................................................19
2.2.3 BGA 焊點(diǎn)疲勞失效典型裂紋特征 .............................................................................20
SMT 單板互連可靠性與典型失效場(chǎng)景
2.2.4 QFN 焊點(diǎn)疲勞失效典型裂紋特征 .............................................................................21
2.2.5 CBGA 焊點(diǎn)疲勞失效典型裂紋特征 ..........................................................................22
2.2.6 CCGA 焊點(diǎn)疲勞失效典型裂紋特征 ..........................................................................23
2.2.7 通孔插裝焊點(diǎn)疲勞失效典型裂紋特征 ......................................................................24
2.2.8 焊接工藝對(duì)裂紋特征的影響 ......................................................................................24
2.3 小結(jié) .........................................................................................................................................25
第 3 章機(jī)械應(yīng)力導(dǎo)致的焊點(diǎn)失效........................................................................... 27
3.1 機(jī)械應(yīng)力失效的典型場(chǎng)景 .....................................................................................................27
3.1.1 沖擊 ..............................................................................................................................27
案例 2：BGA 脫落 ......................................................................................................27
3.1.2 瞬時(shí)彎曲 ......................................................................................................................29
案例 3：插件操作導(dǎo)致 BGA 焊點(diǎn)開(kāi)裂 .....................................................................29
3.1.3 循環(huán)彎曲 ......................................................................................................................31
3.1.4 振動(dòng) ..............................................................................................................................31
3.2 機(jī)械應(yīng)力失效的裂紋特征 .....................................................................................................31
3.3 脆性的界面 IMC ....................................................................................................................33
3.3.1 ENIG 鍍層形成的焊點(diǎn)具有脆性 ................................................................................34
案例 4：Ni 氧化導(dǎo)致焊點(diǎn)界面脆化 ...........................................................................37
3.3.2 不連續(xù)的塊狀 IMC ......................................................................................................40
3.4 典型應(yīng)力敏感元件及應(yīng)力失效 .............................................................................................41
3.4.1 應(yīng)力敏感封裝 ..............................................................................................................41
3.4.2 片式電容 .....................................................................................................................41
3.4.3 球柵陣列封裝 ..............................................................................................................46
案例 5：ICT 測(cè)試導(dǎo)致 BGA 焊點(diǎn)開(kāi)裂 ......................................................................46
案例 6：壓接導(dǎo)致 BGA 焊點(diǎn)開(kāi)裂 .............................................................................48
第 4 章焊點(diǎn)失效分析方法.................................................................................... 51
4.1 失效分析及方法 .....................................................................................................................51
4.1.1 失效分析 ......................................................................................................................51
4.1.2 失效分析思路 ..............................................................................................................51
4.1.3 失效分析基本流程與方法 ..........................................................................................51
4.1.4 焊點(diǎn)失效分析的常用方法 ..........................................................................................52
4.2 X 射線檢測(cè) .............................................................................................................................53
4.2.1 X 射線圖像的采集原理...............................................................................................54
4.2.2 X 射線圖像的分析.......................................................................................................56
4.3 超聲掃描顯微鏡 .....................................................................................................................58
4.3.1 超聲掃描顯微鏡概述 ..................................................................................................58
4.3.2 超聲掃描顯微鏡的工作原理 ...............................